Radiation image acquisition device

ABSTRACT

An apparatus for capturing a radiation image includes a radiation source configured to emit radiation, a wavelength converter configured to receive the radiation emitted from the radiation source through an entrance plane after the emitted radiation has been transmitted by an object, to convert the received radiation to scintillation light, and to output the scintillation light from the entrance plane, a first optical system configured to focus on the entrance plane and to image the output scintillation light thereby generating a first radiation image of the object, and a first image sensor configured to capture the first radiation image to generate first image data.

TECHNICAL FIELD

The present invention relates to a radiation image acquisition device.

BACKGROUND ART

There is the conventionally known apparatus for applying X-rays emittedfrom an X-ray source and transmitted by an imaging object, onto ascintillator of a flat plate shape, detecting visible light(scintillation light) generated in the scintillator, by solid-statephotodetectors laid on both surfaces of the scintillator, andsuperimposing image signals from the respective solid-statephotodetectors on each other to acquire a radiation image, as describedin Patent Literature 1 below. In this apparatus, the photodetectorelements are coupled to the X-ray entrance surface and to the backsurface behind it in the scintillator and the visible light is detectedby each of the entrance-surface-side photodetector element and theback-surface-side photodetector element, thereby increasing efficiencyof detection of the visible light.

CITATION LIST Patent Literature

Patent Literature 1: Japanese Patent Application Laid-open No. H07-27866

SUMMARY OF INVENTION Technical Problem

The apparatus for detecting the scintillation light on the both surfacesof the scintillator as described above can acquire radiation images indifferent energy bands on the entrance surface side and on the backsurface side behind it, so as to enable acquisition of so-calleddual-energy images

In the foregoing conventional apparatus, however, the radiationtransmitted by the object passes through the entrance-surface-sidephotodetector element to reach the scintillator, and for this reason,radiation in a relatively low energy band is absorbed by theentrance-surface-side photodetector element. For example, when theobject is formed of a lightweight atom, the radiation transmitted by theobject can be absorbed by the entrance-surface-side photodetectorelement. As described above, the conventional apparatus has the problemthat the radiation transmitted by the object is affected by theentrance-surface-side photodetector element.

It is therefore an object of the present invention to provide aradiation image acquisition device capable of acquiring radiation imagesin different energy bands while reducing the influence on the radiationtransmitted by the object.

Solution to Problem

A radiation image acquisition device according to one aspect of thepresent invention includes: a radiation source which emits radiation; awavelength conversion member of a flat plate shape which generatesscintillation light according to incidence of the radiation emitted fromthe radiation source and transmitted by an object; first imaging meanswhich condenses and images the scintillation light emitted from anentrance surface for the radiation in the wavelength conversion member;and second imaging means which condenses and images the scintillationlight emitted from a surface opposite to the entrance surface in thewavelength conversion member, wherein one of the first imaging means andthe second imaging means condenses the scintillation light emitted fromthe entrance surface or the opposite surface in a direction of a normalthereto, and wherein the other of the first imaging means and the secondimaging means condenses the scintillation light emitted from theentrance surface or the opposite surface in a direction inclined withrespect to a direction of a normal thereto.

In the radiation image acquisition device according to the one aspect ofthe present invention, the first imaging means and the second imagingmeans condense and image the respective scintillation light beamsemitted from the entrance surface for the radiation and from theopposite surface behind it in the wavelength conversion member. Thisrealizes dual-energy imaging to acquire radiation images in differentenergy bands. In this connection, the first imaging means is arranged ata position apart from the wavelength conversion member, in order tocondense the scintillation light emitted from the entrance surface.Therefore, the radiation image acquisition device can have theconfiguration wherein no imaging means is interposed between the object.and the wavelength conversion member, thereby avoiding an incident suchthat the imaging means affects the radiation transmitted by the object.Accordingly, it is feasible to reduce the influence on the radiationtransmitted by the object. Furthermore, since one of the first imagingmeans and the second imaging means condenses the scintillation lightemitted from the entrance surface or from the opposite surface behind itin the direction of the normal thereto, it can acquire a radiation imagewith no perspective. Therefore, a perspective of the radiation imageacquired by the other imaging means can be properly corrected using theradiation image with no perspective acquired by the one imaging means,as a reference image.

The radiation image acquisition device may be configured in a mode suchthat each of the first imaging means and the second imaging means has: acondensing lens unit for condensing the scintillation light emitted fromthe wavelength conversion member; and an imaging unit for imaging thescintillation light thus condensed. In this case, the scintillationlight is condensed with focus on each of the entrance surface and theopposite surface of the wavelength conversion member, which enablesacquisition of bright radiation images with good energy separation.

The radiation image acquisition device may be configured in a mode suchthat the first imaging means condenses the scintillation light emittedin the direction of the normal to the entrance surface and that thesecond imaging means condenses the scintillation light emitted in thedirection inclined with respect to the direction of the normal to theopposite surface. In this case, since the radiation image acquired bythe first imaging means is an image of the scintillation light resultingfrom conversion near the entrance surface of the wavelength conversionmember, it is less affected by a blur made inside the wavelengthconversion member and thus becomes a clear image without a significantblur. Therefore, the radiation image with no perspective nor significantblur can be used as the reference image, whereby the better referenceimage can be used to correct for the perspective of the radiation imageacquired by the second imaging means.

The radiation image acquisition device may be configured in a mode suchthat the radiation source is arranged on the normal to the entrancesurface and that the first imaging means is arranged at a position offthe normal to the entrance surface so as to condense the scintillationlight via a reflecting mirror arranged between the wavelength conversionmember and the radiation source. In this case, the radiation image withno perspective nor significant blur can be used as the reference image,as described above. In addition, since the radiation source is arrangedon the normal to the entrance surface, no perspective is made in aprojection image on the wavelength conversion member, which eliminates aneed for an operation to correct for a perspective of the projectionimage. Furthermore, the first imaging means can be prevented from beingexposed to the radiation, which can suppress generation of noise insidethe first imaging means.

The radiation image acquisition device may be configured in a mode suchthat the second imaging means is arranged at a position off the normalto the opposite surface so as to condense the scintillation lightemitted in the direction of the normal to the opposite surface, via areflecting mirror arranged on the normal to the opposite surface. Inthis case, the second imaging means can be prevented from being exposedto the radiation, which can suppress generation of noise inside thesecond imaging means. Therefore, when the radiation image acquired bythe second imaging means is used as the reference image, the goodreference image is also available. Furthermore, this configurationpermits adjustment of optical path lengths from the wavelengthconversion member to the first and second imaging means, whichfacilitates position alignment of the first and second imaging means. Asa consequence of this, it becomes easier to match imaging conditions ofthe first and second imaging means (e.g., simultaneity of imaging timesand identity of imaging positions).

The radiation image acquisition device may be configured in a mode suchthat a tapered fiber is arranged between the opposite surface of thewavelength conversion member and the second imaging means so as to facethe opposite surface. In this case, the tapered fiber can condense thescintillation light on the opposite surface side at a high lightcondensing efficiency. Furthermore, the tapered fiber blocks theradiation whereby the second imaging means can be prevented from beingexposed to the radiation. Therefore, when the radiation image acquiredby the second imaging means is used as the reference image, the goodreference image is also available.

The radiation image acquisition device may be configured in a mode suchthat the device further includes: correction means for correcting animage taken by the other imaging means, using an image taken by the oneimaging means, as a reference image.

The radiation image acquisition device may be configured in a mode suchthat the object is a semiconductor device and that the radiation imageacquisition device is applied to a semiconductor failure inspectiondevice an inspection target of which is the semiconductor device. Inthis case, since the radiation transmitted by the semiconductor deviceas the inspection target is not cut by the imaging unit (imaging devicefor acquisition of image), the inspection device can detect a failure orthe like of the semiconductor device with high accuracy.

Advantageous Effect of Invention

The one aspect of the present invention enables the acquisition ofradiation images in different energy bands and the reduction of theinfluence on the radiation transmitted by the object.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a front view of the radiation image acquisition deviceaccording to the first embodiment of the present invention.

FIGS. 2A-2C are an explanatory drawing for explaining a projection imagein the radiation image acquisition device shown in FIG. 1.

FIGS. 3A-3D are an explanatory drawing for explaining a correction for aperspective of an image in the radiation image acquisition device shownin FIG. 1.

FIG. 4 is a front view of the radiation image acquisition deviceaccording to the second embodiment of the present invention.

FIGS. 5A-5D are an explanatory drawing for explaining a correction for aperspective of an image in the radiation image acquisition device shownin FIG. 4.

FIG. 6 is a front view of the radiation image acquisition deviceaccording to the third embodiment of the present invention.

FIGS. 7A-7C are an explanatory drawing for explaining a perspective of aprojection image in the radiation image acquisition device shown in FIG.6.

FIG. 8 is a front view of the radiation image acquisition deviceaccording to the fourth embodiment of the present invention.

FIG. 9 is a front view of the radiation image acquisition deviceaccording to the fifth embodiment of the present invention.

FIG. 10 is a front view of the radiation image acquisition device whichis a modification example of the present invention.

FIGS. 11A-11B are front views of the radiation image acquisition deviceswhich are modification examples of the present invention.

FIGS. 12A-1.2C are front views of the radiation image acquisitiondevices which are modification examples of the present invention.

FIGS. 13A-13D are an explanatory drawing about a modification example ofthe correction for a perspective of an image.

DESCRIPTION OF EMBODIMENTS

Embodiments of the present invention will be described below in detailwith reference to the drawings. Identical or equivalent portions will bedenoted by the same reference signs in the description of the drawings,without redundant description. It is noted that each drawing is preparedby way of illustration only and is depicted so as to emphasize each partas object of description in particular. For this reason, the dimensionalratios of respective members in the drawings are not always coincidentwith actual ones.

As shown in FIG. 1, the radiation image acquisition device 1 is a devicefor acquiring a radiation image of an object A, e.g., an electroniccomponent such as a semiconductor device, or a foodstuff. The radiationimage acquisition device 1 is provided with a radiation source 2 whichemits radiation such as white X-rays toward the object A, a wavelengthconversion plate 6 which generates scintillation light according toincidence of the radiation transmitted by the object A after emittedfrom the radiation source 2, a front observation photodetector 3 whichcondenses and images the scintillation light emitted from an entrancesurface 6 a for the radiation in the wavelength conversion plate 6, anda back observation photodetector 4 which condenses and images thescintillation light emitted from a back surface 6 b being a surfaceopposite to the entrance surface 6 a. These radiation source 2,wavelength conversion plate 6, front observation photodetector 3, andback observation photodetector 4 are housed in a housing not shown andfixed. in the housing.

The wavelength conversion plate 6 is a wavelength conversion member of aflat plate shape, e.g., a scintillator of any one of Gd₂O₂S:Tb,Gd₂O₂S:Pr, CsI:Tl, CdWO₄, CaWO₄, Gd₂SiO₅:Ce, Lu_(0.4)Gd_(1.6)SiO₅,Bi₄Ge₃O₁₂, Lu₂SiO₅:Ce, Y₂SiO₅, YAlO₃:Ce, Y₂O₂S:Tb, YTaO₄:Tm, and so on.The thickness of the wavelength conversion plate 6 is set to anappropriate value depending upon a radiation energy band detected, inthe range of several μm to several mm.

The front observation photodetector 3 (which will be referred tohereinafter as “front detector 3”) is an imaging means of an indirectconversion method that photographs a projection image (radiationtransmission image) of the object A projected on the wavelengthconversion plate 6, from the entrance surface 6 a side of the wavelengthconversion plate 6. The front detector 3 is a detector of a lenscoupling type having a condensing lens unit 3 a for condensing thescintillation light emitted from the entrance surface 6 a of thewavelength conversion plate 6, and an imaging unit 3 b for imaging thescintillation light condensed by the condensing lens unit 3 a. Thecondensing lens unit 3 a condenses the scintillation light in a frontdetector field 13. The imaging unit 3 b to be used herein is, forexample, a CMOS sensor, a CCD sensor, or the like. When the frontdetector 3 corresponds to the below-described one imaging means, a lightreceiving surface of the imaging unit 3 b can be arranged approximatelyparallel to the entrance surface 6 a.

The back observation photodetector 4 (which will be referred tohereinafter as “back detector 4”) is an imaging means of the indirectconversion method that photographs a projection image (radiationtransmission image) of the object A projected on the wavelengthconversion plate 6, from the back surface 6 b side of the wavelengthconversion plate 6. The back detector 4 is a detector of the lenscoupling type having a condensing lens unit 4 a for condensing thescintillation light emitted from the back surface 6 b of the wavelengthconversion plate 6, and an imaging unit 4 b for imaging thescintillation light condensed by the condensing lens unit 4 a, and thusit has the same configuration as the aforementioned front detector 3.The condensing lens unit 4 a condenses the scintillation light in a backdetector field 14. The imaging unit 4 b to be used herein is, forexample, a CMOS sensor, a CCD sensor, or the like. When the backdetector 4 corresponds to the below-described one imaging means, a lightreceiving surface of the imaging unit 4 b can be arranged approximatelyparallel to the back surface 6 b.

Furthermore, the radiation image acquisition device 1 is provided with atiming control unit 7 for controlling imaging timing at the frontdetector 3 and at the back detector 4, an image processing device 8 forreceiving input image signals from the front detector 3 and from theback detector 4 and executing a predetermined processing procedure suchas image processing based on each of the input image signals, and adisplay device 9 for receiving an input image signal from the imageprocessing device 8 and displaying a radiation image. The timing controlunit 7 and the image processing device 8 are composed of a computerhaving a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM(Random Access Memory), input/output interfaces, and so on. The displaydevice 9 to be used herein is a well-known display. The timing controlunit 7 and the image processing device 8 may be configured as a programexecuted by a single computer or as respective units providedindividually.

The below will describe the positional relationship among theaforementioned radiation source 2, wavelength conversion plate 6, frontdetector 3, and back detector 4. As shown in FIG. 1, the radiationsource 2 is arranged so that an optical axis X of the radiationcoincides with a normal B to the entrance surface 6 a of the wavelengthconversion plate 6. Namely, the radiation source 2 faces the object Aand the entrance surface 6 a and is arranged on the normal B to theentrance surface 6 a. The optical axis X of the radiation herein is astraight line connecting a radiation emission point of the radiationsource 2 and an arbitrary point γ on the entrance surface 6 a of thewavelength conversion plate 6. In the present embodiment, the arbitrarypoint γ is set to be a central point of the entrance surface 6 a and inthis case, the radiation is radiated with little relative unevenness.The normal B here is a straight line extending normally to the entrancesurface 6 a from an arbitrary point α on the entrance surface 6 a. Inthe present embodiment, the arbitrary point α is set to be the centralpoint of the entrance surface 6 a and thus the optical axis X of theradiation and the normal B coincide with each other. It is a matter ofcourse that the arbitrary point γ and the arbitrary point α do not haveto be coincident with the central point of the entrance surface 6 a.

The front detector 3 is arranged so that an optical axis F of theincorporated condensing lens unit 3 a makes a predetermined angle θ₁with respect to the normal B to the entrance surface 6 a, so as to beable to image the scintillation light emitted from the entrance surface6 a of the wavelength conversion plate 6. Namely, the front detector 3faces the entrance surface 6 a and is arranged at a position off thenormal B to the entrance surface 6 a. This condensing lens unit 3 afocuses on the entrance surface 6 a and condenses the scintillationlight emitted in a direction at the angle θ₁ to the normal B from theentrance surface 6 a, toward the imaging unit 3 b. The condensing lensunit 3 a to be used herein can be a shift lens or a tilt lens. Thisfront detector 3 corresponds to the other imaging means for condensingthe scintillation light emitted in the direction inclined with respectto the direction of the normal B from the entrance surface 6 a.

As described above, the front detector 3 is arranged off the opticalaxis X of the radiation source 2. Namely, the front detector 3 isarranged so as to be located apart from an emission region of theradiation from the radiation source 2 (which is a region where aradiation beam 12 exists) This arrangement prevents the front detector 3from being exposed to the radiation from the radiation source 2 andprevents a direct conversion signal of radiation from being producedinside the front detector 3 to generate noise.

The back detector 4 is arranged so that an optical axis G of theincorporated condensing lens unit 4 a is perpendicular to the backsurface 6 b, so as to be able to image the scintillation light emittedfrom the back surface 6 b of the wavelength conversion plate 6. In thisconfiguration, the optical axis G of the condensing lens unit 4 a iscoincident with a. normal C to the back surface 6 b. Namely, the backdetector 4 faces the back surface 6 b and is arranged on the normal C tothe back surface 6 b. Therefore, the back detector 4 can image thescintillation light emitted in the direction of the normal C to the backsurface 6 b and thus readily acquire an image without a significantperspective. The normal C here is a straight line extending normally tothe back surface 6 b from an arbitrary point β on the back surface 6 b,Particularly, in the present embodiment, the arbitrary point β is set ata central point of the back surface 6 b, the arbitrary point α on theentrance surface 6 a and the arbitrary point β on the back surface 6 bare located on the same straight line, and this straight line iscoincident with the normal B and the normal C. The condensing lens unit4 a focuses on the back surface 6 b and condenses the scintillationlight emitted in the direction of the normal C from the back surface 6b, toward the imaging unit 4 b. This back detector 4 corresponds to theone imaging means for condensing the scintillation light emitted in thedirection of the normal C from the back surface 6 b.

In the radiation image acquisition device 1, an optical path length fromthe entrance surface 6 a of the wavelength conversion plate 6 to thefront detector 3 is equal to an optical path length from the backsurface 6 b of the wavelength conversion plate 6 to the back detector 4.The optical path length from the entrance surface 6 a of the wavelengthconversion plate 6 to the front detector 3 may be different from theoptical path length from the back surface 6 b of the wavelengthconversion plate 6 to the back detector 4, but in this case, the sizesof the images need to be matched by image processing or the like.

The following will describe the operation of the radiation imageacquisition device 1 having the above-described configuration. First,the timing control unit 7 performs control to make the front detector 3and the back detector 4 simultaneously carry out their respectiveimaging operations. The imaging of radiation transmission images of theobject A. in different energy bands can be implemented based on theimaging timing control by the timing control unit 7. In more detail, thefront detector 3 acquires the radiation transmission image in arelatively low energy band and the back detector 4 the radiationtransmission image in a relatively high energy band. This operationrealizes dual-energy imaging. It is noted that the radiation imageacquisition device 1 is configured to allow control to make the imagingtimes of the front detector 3 and the back detector 4 different fromeach other. The device may also be configured to control the frontdetector 3 and the back detector 4 to different exposure times and/ordifferent numbers of photos taken thereby.

The functions of the front detector 3 and the back detector 4 will. bespecifically described in more detail. The front detector 3 detectsfluorescence (scintillation light) resulting from conversion on the siderelatively near the entrance surface 6 a. The detection of thefluorescence resulting from the conversion on the entrance surface 6 aside is characterized by little blurring of fluorescence and highluminance of fluorescence. This is because the front observation can beless affected by diffusion and self-absorption inside the wavelengthconversion plate 6. On the other hand, the back detector 4 detectsfluorescence resulting from conversion on the side relatively near theback surface 6 b of the wavelength conversion plate 6. In this case aswell, the observation can be less affected by diffusion andself-absorption inside the wavelength conversion plate 6.

Next, the front detector 3 and the back detector 4 output theirrespective image signals corresponding to the radiation images on bothof the front and back surfaces, to the image processing device 8. Whenthe image processing device 8 receives the respective input imagesignals from the front detector 3 and from the back detector 4, theimage processing device 8 executes the predetermined processing such asan inter-image operation, e.g., a perspective correction, a differentialoperation, or an addition operation, based on the input image signals,and outputs an image signal after the image processing to the displaydevice 9. When the display device 9 receives the input image signalafter the image processing from the image processing device 8, thedisplay device 9 displays a radiation image according to the input imagesignal after the image processing.

FIG. 2A is a perspective view showing the positional relationship amongthe radiation source 2, object A, and wavelength conversion plate 6 inthe radiation image acquisition device 1, FIG. 2B a front view showingthe positional relationship among the radiation source 2, object A, andwavelength conversion plate 6, and FIG. 2C a plan view showing aprojection image D of the object A projected on the wavelengthconversion plate 6. FIGS. 2A-2C show a situation in which the object Ais of a 3D shape, for easier understanding. When the radiation source 2is arranged on the normal B to the entrance surface 6 a and the opticalaxis X of the radiation coincides with the normal B to the entrancesurface 6 a as shown in FIG. 2A, no perspective is made in theprojection image D onto the entrance surface 6 a, as shown in FIG. 2C.

FIG. 3A is a perspective view showing the positional relationship amongthe front detector 3, back detector 4, and wavelength conversion plate 6in the radiation image acquisition device 1, FIG. 3B a drawing showing afront-side image Pa acquired by the front detector 3 and fed to theimage processing device 8, and FIG. 3C a drawing showing a back-sideimage Pb acquired by the back detector 4 and fed to the image processingdevice 8.

When the front detector 3 is arranged at the position off the normal Bto the entrance surface 6 a and the optical axis F makes thepredetermined angle θ₁ with respect to the normal B to the entrancesurface 6 a as shown in FIG. 3A, a perspective is made in the front-sideimage Pa, as shown in FIG. 3B. On the other hand, when the back detector4 is arranged on the normal C to the back surface 6 b and the opticalaxis G is coincident with the normal C, no perspective is made in theback-side image Pb, as shown in FIG. 3C.

The image processing device 8 recognizes a portion of the projectionimage D on the wavelength conversion plate 6 as a feature part d (acolored portion corresponding to a side face of the object A, in theexample of FIGS. 3A-3C. The perspective appears uniform in a front-sidewavelength-conversion-plate image 20 a being a photographic image of thewavelength conversion plate 6, a front-side object image Ha being aphotographic image of the object A, and a front-side feature-part imageha being a part of the front-side object image Ha and a photographicimage of the feature part d, in the front-side image Pa.

Then the image processing device 8 functions as a correction means tocorrect for the perspective of the front-side image Pa using theback-side image Pb as a reference image. As a result, as shown in FIG.3D, the device acquires a corrected front-side image Pc without aperspective approximately matched with the back-side image Pb andgenerates an image signal corresponding to the front-side image Pc.Namely, this perspective correction process makes a front-sidewavelength-conversion-plate image 20 c, a corrected front-side objectimage Hc, and a front-side feature-part image hc included in thecorrected front-side image Pc approximately identical in position, size,and shape to a back-side wavelength-conversion-plate image 20 b, aback-side object image Hb, and a back-side feature-part image hbincluded in the back-side image Pb as the reference image.

In the radiation image acquisition device 1 of the present embodimentdescribed above, the front detector 3 and the back detector 4 condenseand image the respective scintillation light beams emitted from theentrance surface 6 a and the back surface 6 b of the wavelengthconversion plate 6, thereby realizing the dual-energy imaging to acquireradiation images in different energy bands. In this configuration, thefront detector 3 is arranged at the position apart from the wavelengthconversion plate 6, without any detector interposed between the object Aand the wavelength conversion plate 6. This configuration permits thedevice to avoid the incident that the imaging means affects theradiation transmitted by the object A. Therefore, the influence on theradiation transmitted by the object A is reduced and the radiation in alow energy band is suitably detected. In other words, no shadow ofdetector is cast on the radiation transmission images, so as to suppressgeneration of noise component and cause no attenuation of radiation dueto the detector, thus suppressing reduction of signal components. As aresult, it becomes feasible to make a difference between the low energyband and the high energy band in the dual-energy imaging larger and toexhibit a high energy resolution, allowing achievement of highercontrast. This advantage is prominently demonstrated, particularly, inthe case where the object A is formed of silicon or an atom lighter inweight than silicon. Namely, even if the object A is formed of alightweight atom, the radiation in the low energy band transmitted bythe object A is converted into scintillation light, without beingabsorbed or attenuated, and this light is imaged by the front detector3; therefore, the radiation image in the low energy band can be acquiredwith accuracy. Furthermore, the low-energy image and the high-energyimage can be simultaneously acquired by a single imaging operation, soas to ensure simultaneity, reduce an exposure dose, and avoid pixelshifts (misregistration). The dual-energy imaging can be realized evenby means of the single wavelength conversion plate 6. In addition, sincethe back detector 4 condenses the scintillation light emitted in thedirection of the normal C to the back surface 6 b, it can acquire theback-side image Pb without a perspective, and the perspective of thefront-side image Pa can be properly corrected using this back-side imagePb as a reference image.

When white X-rays are used as the radiation, the low-energy image andthe high-energy image can also be simultaneously acquired by a singleimaging operation of white X-rays, so as to ensure simultaneity, reducean exposure dose, and avoid pixel shifts (misregistration).

As the condensing lens unit 3 a and the condensing lens unit 4 acondense the light with focus on each of the entrance surface 6 a andthe back. surface 6 b of the wavelength conversion plate 6, brightradiation images can be acquired with good energy separation.

FIG. 4 is a front view of the radiation image acquisition deviceaccording to the second embodiment. The radiation image acquisitiondevice 1A shown in FIG. 4 is different from the radiation imageacquisition device 1 of the first embodiment shown in FIG. 1 in that thefront detector 3 is arranged at a position off the normal B to theentrance surface 6 a so as to condense the scintillation light via areflecting mirror 15 arranged on the normal B (optical axis X) betweenthe wavelength conversion plate 6 and the radiation source 2 andtransmitting the radiation and in that the back detector 4 is arrangedso that the optical axis G of the condensing lens unit 4 a makes apredetermined angle θ₂ with respect to the normal C to the back surface6 b. FIG. 4 is depicted without illustration of the timing control unit7, image processing device 8, and display device 9. FIGS. 6 and 8 to 12Care also depicted similarly without illustration of these components.

The configuration of the radiation image acquisition device 1A will bedescribed more specifically. The reflecting mirror 15 is arranged sothat its reflective surface 15 a makes a predetermined angle (e.g., 45°)with respect to the direction of the normal B so as to reflect thescintillation light emitted in the direction of the normal B from theentrance surface 6 a, into a predetermined direction relative to thenormal B. The reflecting mirror 15 to be used herein is, for example, anoptical mirror. The front detector 3 is arranged so that an anglebetween the optical axis F of the incorporated condensing lens unit 3 aand the reflective surface 15 a is equal to the angle between the normalB and the reflective surface 15 a. This condensing lens unit 3 acondenses the scintillation light emitted in the direction of the normalB from the entrance surface 6 a and reflected into the predetermineddirection relative to the normal B by the reflecting mirror 15, towardthe imaging unit 3 b. This front detector 3 corresponds to the oneimaging means for condensing the scintillation light emitted in thedirection of the normal B from the entrance surface 6 a.

The back detector 4 faces the back surface 6 b and is arranged at aposition off the normal C to the back surface 6 b. This condensing lensunit 4 a condenses the scintillation light emitted from the back surface6 b in a direction at the angle θ₂ to the normal C, toward the imagingunit 4 b. The condensing lens unit 4 a to be used herein can be a shiftlens or a tilt lens. This back detector 4 corresponds to the otherimaging means for condensing the scintillation light emitted from theback surface 6 b in the direction inclined with respect to the directionof the normal C.

As described above, the front detector 3 is arranged so as to be apartfrom the radiation emission region from the radiation source 2 (theregion where the radiation beam 12 exists). This arrangement preventsthe front detector 3 from being exposed to the radiation from theradiation source 2, and thus prevents a direct conversion signal ofradiation from being produced inside the front detector 3 to generatenoise. Furthermore, the optical path length from the entrance surface 6a of the wavelength conversion plate 6 to the front detector 3 may beset equal to the optical path length from the back surface 6 b of thewavelength conversion plate 6 to the back detector 4.

In the radiation image acquisition device 1A, no perspective is made inthe projection image D onto the entrance surface 6 a (cf. FIGS. 2A-2C),either, as in the radiation image acquisition device 1.

FIG. 5A is a perspective view showing the positional relationship amongthe front detector 3, back detector 4, and wavelength conversion plate 6in the radiation image acquisition device 1A, FIG. 5B a drawing showingthe front side image Pa acquired by the front detector 3 and fed to theimage processing device 8, and FIG. 5C a drawing showing the back-sideimage Pb acquired by the back detector 4 and fed to the image processingdevice 8.

When the front detector 3 condenses the scintillation light emitted inthe direction of the normal B from the entrance surface 6 a andreflected in the direction perpendicular to the normal B to the entrancesurface 6 a, toward the imaging unit 3 b as shown in FIG. 5A, noperspective is made in the front-side image Pa, as shown in FIG. 5B. Onthe other hand, when the back detector 4 is arranged at the position offthe normal C to the back surface 6 b with the optical axis G making thepredetermined angle θ₂ relative to the normal C to the back surface 6 bas shown in FIG. 5A, a perspective is made in the back-side image Pb, asshown in FIG. 5C.

Then the image processing device 8 recognizes a part of the projectionimage D on the wavelength conversion plate 6 as a feature part d (acolored portion corresponding to a side face of the object A, in theexample of FIGS. 5A-5D). The perspective appears uniform in a back-sidewavelength-conversion-plate image 20 b being a photographic image of thewavelength conversion plate 6, a back-side object image Hb being aphotographic image of the object A, and a back-side feature-part imagehb being a part of the back-side object image Hb and a photographicimage of the feature part d, in the back-side image Pb.

Then the image processing device 8 functions as a correction means tocorrect for the perspective of the back-side image Pb using thefront-side image Pa as a reference image. As a result, as shown in FIG.5D, the device acquires a corrected back-side image Pd without aperspective approximately matched with the front-side image Pa andgenerates an image signal corresponding to the back-side image Pd.Namely, this perspective correction process makes a back-sidewavelength-conversion-plate image 20 d, a back-side object image Hd, anda back-side feature-part image hd included in the corrected back-sideimage Pd approximately identical in position, size, and shape to afront-side wavelength-conversion-plate image 20 a, a front-side objectimage Ha, and a front-side feature-part image ha included in thefront-side image Pa as the reference image.

The radiation image acquisition device 1A achieves the same operationaleffect as the radiation image acquisition device 1 does. Since thefront-side image Pa acquired by the front detector 3 is the image of thescintillation light resulting from the conversion near the entrancesurface 6 a. of the wavelength conversion plate 6, it is less affectedby a blur made inside the wavelength conversion member 6 and thusbecomes a clear image without a significant blur. Therefore, the clearfront-side image Pa with no perspective nor significant blur can be usedas the reference image, whereby the better reference image is availablefor the correction for the perspective of the back-side image Pbacquired by the back detector 4.

The perspective correction process by the image processing device 8 isto correct the back-side image Pb on the basis of the clear front-sideimage Pa without a significant blur as the reference image, whereby aclear tomographic image is also obtained as an image resulting from theinter-image operation between the front-side image Pa and the back-sideimage Pd.

In addition, since the radiation source 2 is arranged on the normal B tothe entrance surface 6 a, no perspective is made in the projection imageD onto the wavelength conversion plate 6, either, which eliminates aneed for a correction for a perspective of the projection image D.Furthermore, the front detector 3 is prevented from being exposed to theradiation, which prevents generation of noise inside the front detector3.

FIG. 6 is a front view of the radiation image acquisition deviceaccording to the third embodiment. The radiation image acquisitiondevice 1B shown in. FIG. 6 is different from the radiation imageacquisition device 1A of the second embodiment shown in FIG. 4 in thatthe radiation source 2 is arranged so that the optical axis X of theradiation makes a predetermined angle θ with respect to the normal B tothe entrance surface 6 a and in that the front detector 3 is arranged onthe normal B to the entrance surface 6 a. More specifically, the frontdetector 3 is arranged so that the optical axis F of the condensing lensunit 3 a is perpendicular to the entrance surface 6 a, In thisembodiment, the optical axis F of the condensing lens unit 3 a iscoincident with the normal B to the entrance surface 6 a. Furthermore,the back detector 4 is arranged so that the optical axis G of thecondensing lens unit 4 a and the optical axis X of the radiation source2 are located on the same plane and on the same side with respect to thenormals B, C, It is noted herein that the arbitrary point γ and thearbitrary point α do not have to be the central point of the entrancesurface 6 a and do not have to be the same point, either.

As described above, the front detector 3 is arranged off the opticalaxis X of the radiation source 2. Namely, the front detector 3 isarranged apart from the radiation emission region from the radiationsource 2 (the region where the radiation beam 12 exists). Thisarrangement prevents the front detector 3 from being exposed to theradiation from the radiation source 2 and thus prevents a directconversion signal of radiation from being produced inside the frontdetector 3 to generate noise.

FIG. 7A is a perspective view showing the positional relationship amongthe radiation source 2, object A, and wavelength conversion plate 6 inthe radiation image acquisition device 1B, FIG. 7B a front view showingthe positional relationship among the radiation source 2, object A, andwavelength conversion plate 6, and FIG. 7C a plan view showing aprojection image E of the object A projected on the wavelengthconversion plate 6. FIGS. 7A-7C show a situation in which the object Ais of a 3D shape, for easier understanding. When the radiation source 2is arranged at the position off the normal. B to the entrance surface 6a and the optical axis X of the radiation makes the predetermined angleθ with respect to the normal B to the entrance surface 6 a as shown inFIG. 7A, a perspective is made in the projection image E onto theentrance surface 6 a, as shown in FIG. 7C. This perspective of theprojection image E is corrected according to needs by the imageprocessing device 8. Although FIG. 7A shows that the main body of theradiation source 2 is parallel to the optical axis X, for convenience'sake of explanation, the orientation of arrangement of the radiationsource 2 can be optionally set according to the layout of the device.

The radiation image acquisition device 1B achieves the same operationaleffect as the radiation image acquisition devices 1 and 1A do.

FIG. 8 is a front view of the radiation image acquisition deviceaccording to the third embodiment. The radiation image acquisitiondevice 1C shown in FIG. 8 is different from the radiation imageacquisition device 1 of the first embodiment shown in FIG. 1 in that theback detector 4 is arranged at a position off the normal C to the backsurface 6 b so as to condense the scintillation light via a reflectingmirror 16 arranged on the normal C. More specifically, the reflectingmirror 16 is arranged so that its reflective surface 16 a makes apredetermined angle (e.g., 45°) with respect to the direction of thenormal C and thus it reflects the scintillation light emitted in thedirection of the normal C from the back surface 6 b, into apredetermined direction with respect to the normal C. The reflectingmirror 16 to be used herein is, for example, an optical mirror or aprism. The back detector 4 is arranged so that an angle between theoptical axis G of the incorporated condensing lens unit 4 a and thereflective surface 16 a is equal to the angle between the normal C andthe reflective surface 16 a. This condensing lens unit 4 a condenses thescintillation light emitted in the direction of the normal C from theback surface 6 b and reflected in the predetermined direction relativeto the normal C by the reflecting mirror 16, toward the imaging unit 4b.

As described above, the back detector 4 is arranged so as to be apartfrom the radiation emission region from the radiation source 2 (theregion where the radiation beam 12 exists). This arrangement preventsthe back detector 4 from being exposed to the radiation from theradiation source 2, and thus prevents a direct conversion signal ofradiation from being produced inside the back detector 4 to generatenoise. Furthermore, the optical path length from the entrance surface 6a of the wavelength conversion plate 6 to the front detector 3 may beset equal to the optical path length from the back surface 6 b of thewavelength conversion plate 6 to the back detector 4.

The radiation image acquisition device 1C achieves the same operationaleffect as the radiation image acquisition devices 1, 1A, and 1B do. Inaddition, the back detector 4 is prevented from being exposed to theradiation, which prevents generation of noise inside the back detector4. Furthermore, the optical path lengths from the wavelength conversionplate 6 to the front detector 3 and the back detector 4 are allowed toadjust, which facilitates position alignment of the first and secondimaging means. As a consequence of this, it becomes easier to match theimaging conditions of the first and second imaging means (e.g.,simultaneity of imaging times and identity of imaging positions).

FIG. 9 is a front view of the radiation image acquisition deviceaccording to the fifth embodiment. The radiation image acquisitiondevice 1D shown in FIG. 9 is different from the radiation imageacquisition device 1 of the first embodiment shown in FIG. 1 in that atapered fiber 17 is arranged so as to face the back surface 6 b betweenthe back surface 6 b and the back detector 4. More specifically, thetapered fiber 17 is arranged so that its axis is coincident with thenormal C to the back surface 6 b, so as to guide the scintillation lightemitted in the direction of the normal C from the back surface 6 b, tothe condensing lens unit of the back detector 4. This tapered fiber 17and the back detector 4 constitute a fiber coupling detector 18.

The radiation image acquisition device 1D achieves the same operationaleffect as the radiation image acquisition devices 1, and 1A to 1C do.The tapered fiber 17 condenses the scintillation light on the backsurface 6 b side at a high light condensing efficiency. An ordinaryfluorescent image tends to become dark on the back surface 6 b side ofthe wavelength conversion plate 6, but a loss in the optical system canbe reduced by adopting the fiber coupling detector 18. Furthermore, thetapered fiber 17 blocks the radiation from the radiation source 2, so asto prevent exposure of the back detector 4 thereto.

The above described the embodiments of the present invention but thepresent invention is by no means intended to be limited to the aboveembodiments. For example, as shown in FIG. 10, the radiation imageacquisition device 1E may be so configured that the radiation source 2is arranged off the normal B to the entrance surface 6 a and that thereflecting mirror 15 is arranged on the entrance surface 6 a side. Inthis case, the back detector 4 is arranged so that the optical axis G ofthe condensing lens unit 4 a and the optical axis X of the radiationsource 2 are located on the same plane and on the same side with respectto the normals B, C.

Furthermore, various modifications as shown in FIGS. 11A-11B may beadopted in the configuration wherein the radiation source 2 is arrangedoff the normal B to the entrance surface 6 a, Specifically, as shown inFIG. 11A, the radiation image acquisition device 1F may be so configuredthat the front detector 3 is arranged on the normal B to the entrancesurface 6 a and that the back detector 4 is arranged so that the opticalaxis G of the condensing lens unit 4 a makes the predetermined angle θ₂with respect to the normal C to the back surface 6 b. In thismodification, the back detector 4 is arranged so that the optical axis Gof the condensing lens unit 4 a and the optical axis X of the radiationsource 2 are located on the same plane and on the sides opposite to eachother with respect to the normals B, C. Furthermore, as shown in FIG.11B, the radiation image acquisition device 1G may be so configured thatthe reflecting mirror 15 is arranged on the entrance surface 6 a sideand that the back detector 4 is arranged so that the optical axis G ofthe condensing lens unit 4 a makes the predetermined angle θ₂ withrespect to the normal C to the back surface 6 b. In this case as well,the back detector 4 is arranged in the same manner as in the radiationimage acquisition device 1F. In these radiation image acquisitiondevices 1F and 1G, the front detector 3 corresponds to the one imagingmeans and the back detector 4 to the other imaging means.

Furthermore, various modifications as shown in FIGS. 12A-12C can also beadopted in the configuration wherein the radiation source 2 is arrangedoff the normal B to the entrance surface 6 a, Specifically, as shown inFIG. 12A, the radiation image acquisition device 1H may be so configuredthat the front detector 3 is arranged so that the optical axis F of thecondensing lens unit 3 a makes the predetermined angle θ₁ with respectto the normal B to the entrance surface 6 a, and that the back detector4 is arranged on the normal C to the back surface 6 b, Moreover, asshown in FIG. 12B, the radiation image acquisition device 1J may be soconfigured that the front detector 3 is arranged so that the opticalaxis F of the condensing lens unit 3 a makes the predetermined angle θ₁with respect to the normal B to the entrance surface 6 a, and that thereflecting mirror 16 is arranged on the back surface 6 b side.Furthermore, as shown in. FIG. 12C, the radiation image acquisitiondevice 1K may be so configured that the front detector 3 is arranged sothat the optical axis F of the condensing lens unit 3 a makes thepredetermined angle θ₁ with respect to the normal B to the entrancesurface 6 a, and that the fiber coupling detector 18 is arranged on theback surface 6 b side. In these radiation image acquisition devices 1H,1J, and 1K, the back detector 4 corresponds to the one imaging means andthe front detector 3 corresponds to the other imaging means.

The above embodiments described the examples wherein the perspectivecorrection by the image processing device 8 was to correct the imagewith a perspective using the image of the feature part d of theprojection image D, but the perspective correction does not have to belimited to this technique. For example, the perspective correction maybe made, as shown in FIGS. 13A-13D, in such a manner that correctionmarks (signs) R are given at corners (two corners on a diagonal line onthe wavelength conversion plate 6 in the example of FIGS. 13A-13D) onthe entrance surface 6 a and on the back surface 6 b of the wavelengthconversion plate 6 and that the correction is made using front-sidecorrection-mark images Sa and back-side correction-mark images Sb beingimages of the correction marks R. In the example shown in FIGS. 13A-13D,the back-side image Pb is corrected for its perspective using thefront-side image Pa as a reference image, thereby obtaining thecorrected back-side image Pd. In this operation, the perspectivecorrection is made so as to match the spaces and shapes between thefront-side correction-mark images Sa in the front-side image Pa andcorrected back-side correction-mark images Sd in the back-side image Pd.The correction marks on the wavelength conversion plate 6 may be aplurality of marks given at positions apart from each other, and asingle mark will also suffice.

The above embodiments, in the cases using the reflecting mirror 15 or16, described the examples wherein the reflecting mirror 15, 16 wasarranged at the angle of 45° with respect to the normal B, C and whereinthe optical axis of the condensing lens unit 3 a, 4 a was perpendicularto the normal B, C, but, without having to be limited to thisarrangement, the angle of the reflecting mirror 15, 16 and thearrangement of the front detector 3 and the back detector 4 may beoptionally modified according to the layout in the device.

The radiation source 2, front detector 3, and back detector 4 do notalways have to be limited to the configuration wherein the optical axisX, the optical axis F, and the optical axis G are arranged on the sameplane, but they may also be three-dimensionally arranged according tocircumstances around the axis along the directions of the normals B, C.

The above embodiments described the mode in which when the frontdetector 3 condensed the scintillation light emitted in the directioninclined with respect to the direction of the normal B to the entrancesurface 6 a, the front detector 3 was arranged so that the optical axisF of the condensing lens unit 3 a made the predetermined angle θ₁ withrespect to the normal B to the entrance surface 6 a, but the presentinvention is not limited solely to this mode. For example, the frontdetector 3 may be arranged so that the optical axis F of the condensinglens unit 3 a is perpendicular to the entrance surface 6 a (i.e.,parallel to the normal B) and the optical axis F is located outside therange of the entrance surface 6 a. In this case, the front detector 3can also function as the other imaging means to condense and image thescintillation light emitted in a direction inclined with respect to thedirection of the normal B from the entrance surface 6 a.

The above embodiments described the mode in which when the back detector4 condensed the scintillation light emitted in the direction inclinedwith respect to the direction of the normal C to the back surface 6 b,the back detector 4 was arranged so that the optical axis G of thecondensing lens unit 4 a made the predetermined angle θ₂ with respect tothe normal C to the back surface 6 b, but the present invention is notlimited solely to this mode. For example, the back detector 4 may bearranged so that the optical axis G of the condensing lens unit 4 a isperpendicular to the back surface 6 b (i.e., parallel to the normal C)and the optical axis G is located outside the range of the back surface6 b. In this case, the back detector 4 can also function as the otherimaging means to condense and image the scintillation light emitted in adirection inclined with respect to the direction of the normal C fromthe back surface 6 b.

The above embodiments used the lens coupling type detectors asdetectors, but the condensing lens unit and the imaging unit may beprovided as separate members.

An effective application is such that the object A is a semiconductordevice and the radiation image acquisition device of the aboveembodiment is applied to a semiconductor failure inspection device aninspection target of which is the semiconductor device. In this case,the radiation transmitted by the semiconductor device as the inspectiontarget is not cut by the imaging unit (imaging device for acquisition ofimage) and thus a failure or the like of the semiconductor device can bedetected with accuracy.

INDUSTRIAL APPLICABILITY

The one aspect of the present invention enables the acquisition ofradiation images in different energy bands and the reduction of theinfluence on the radiation transmitted by the object.

REFERENCE SIGNS LIST

1, 1A-1H, 1J, 1K radiation image acquisition devices; 2 radiationsource; 3 front observation photodetector (first imaging means); 3 acondensing lens unit; 3 b imaging unit; 4 back observation photodetector(second imaging means); 4 a condensing lens unit; 4 b imaging unit; 6wavelength conversion plate (wavelength conversion member); 6 a entrancesurface; 6 b back surface (opposite surface); 8 image processing device(correction means); 15 reflecting mirror; 16 reflecting mirror; 17tapered fiber; A object; B normal to entrance surface; C normal to backsurface.

The invention claimed is:
 1. An apparatus for capturing a radiationimage, the apparatus comprising: a radiation source configured to emitradiation; a wavelength converter having an entrance plane, wherein thewavelength converter is configured to receive the radiation emitted fromthe radiation source through the entrance plane after the emittedradiation has been transmitted by an object, to convert the receivedradiation to scintillation light, and to output the scintillation lightfrom the entrance plane; a first optical system including at least onelens, the first optical system being configured to focus on the entranceplane and to image the output scintillation light, thereby generating afirst radiation image of the object; and a first image sensor configuredto capture the first radiation image to generate first image data. 2.The apparatus according to claim 1, wherein an optical axis of the firstoptical system is inclined with respect to a direction normal to theentrance plane.
 3. The apparatus according to claim 1, wherein anoptical axis of the first optical system is perpendicular to theentrance plane.
 4. The apparatus according to claim 1, furthercomprising: a mirror configured to reflect the output scintillationlight.
 5. The apparatus according to claim 1, wherein the wavelengthconverter comprises a scintillator.
 6. The apparatus according to claim1, further comprising: an image processor configured to correct thefirst image data.
 7. The apparatus according to claim 1, wherein thefirst optical system includes a shift lens.
 8. The apparatus accordingto claim 1, wherein the first optical system includes a tilt lens.